Flexible Electronics News

Qolpac, Holst Centre to Bring Smart Blister Packaging to Mass Market

Partnership to develop existing smart blister technology for high-volume pharmaceutical applications.

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By: DAVID SAVASTANO

Editor, Ink World Magazine

Holst Centre and Qolpac have extended their partnership to develop existing smart blister technology for high-volume pharmaceutical applications. Under the agreement, Qolpac joins Holst Centre’s “Integration technologies for flexible systems” shared research program. Together, the new partners will extend Holst Centre’s existing thin-foil smart blister technology to create intelligent tablet packaging that actively helps people adhere to medication regimes. Smart blisters are pharmaceutic...

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